Enabling Volume-Compatible Photonic Medical Devices Through Hybrid Integration Assembly
A highly integrated and compact photonic module is realised using state-of-the-art wafer-level assembly processes, paving the way for volume production. This advancement opens new avenues for cost-effective and user-friendly point-of-care medical devices, facilitating early detection of cardiovascular conditions.
Authors
- Chirag Murendranath Patil (ORCID: https://orcid.org/0000-0002-7128-5715)
- Yanlu Li (ORCID: https://orcid.org/0000-0003-3440-1972)
- Padraic E. Morrissey (ORCID: https://orcid.org/0000-0002-3876-7317)
- Peter O’Brien (ORCID: https://orcid.org/0000-0003-3184-3759)
- Søren Aasmul
- Pavel Záruba (ORCID: https://orcid.org/0000-0001-8966-1355)
- Martin Žoldák
- Michael L. Hall (ORCID: https://orcid.org/0000-0002-7186-5912)
Institutions
- Ghent University (BE)
- International Energy Research Centre (IE)
- Medtronic (Netherlands) (NL)
Publication Details
- Published
- 2024-11-10
- DOI
- https://doi.org/10.1109/ipc60965.2024.10799614
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00