Laser to PIC Coupling using Hybrid Photonic Packaging
We demonstrate laser to photonic integrated circuit edge coupling using a III-V/SiN hybrid integration technique. Low coupling loss from the laser to PIC was achieved without the need for any additional coupling optics. Using an active alignment technique, additional loss due to packaging was minimised.
Authors
- Padraic E. Morrissey (ORCID: https://orcid.org/0000-0002-3876-7317)
- Sharon M. Butler
- Peter C. O’Brien (ORCID: https://orcid.org/0000-0002-1288-9439)
- Matthew Hall (ORCID: https://orcid.org/0000-0002-6593-3210)
Publication Details
- Published
- 2024-11-10
- DOI
- https://doi.org/10.1109/ipc60965.2024.10799856
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00