Development of Electrical and Optical Packaging for Silicon Photonic MEMS
We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72 channel fiber array to couple to on-chip fiber grating couplers with minimal transmission loss at 1543 nm wavelength.
Authors
- Pierre Edinger (ORCID: https://orcid.org/0000-0002-7339-6662)
- Gaehun Jo (ORCID: https://orcid.org/0000-0002-2752-7422)
- Kristinn B. Gylfason (ORCID: https://orcid.org/0000-0001-9008-8402)
- Jun Su Lee (ORCID: https://orcid.org/0000-0003-0470-7583)
- Seán Collins (ORCID: https://orcid.org/0000-0002-7728-8669)
- Peter O’Brien (ORCID: https://orcid.org/0000-0003-3184-3759)
- Wim Bogaerts (ORCID: https://orcid.org/0000-0003-1112-8950)
- Cleitus Antony (ORCID: https://orcid.org/0000-0003-0466-8115)
- Umar Khan (ORCID: https://orcid.org/0000-0001-5760-7485)
- Niels Quack (ORCID: https://orcid.org/0000-0001-5189-0929)
- Arun Kumar Mallik (ORCID: https://orcid.org/0000-0002-8772-1534)
- Iman Zand (ORCID: https://orcid.org/0000-0001-9857-7331)
- Frank Niklaus (ORCID: https://orcid.org/0000-0002-0525-8647)
- Padraic E. Morissay
Institutions
- Ghent University (BE)
- École Polytechnique Fédérale de Lausanne (CH)
- KTH Royal Institute of Technology (SE)
Publication Details
- Published
- 2024-11-10
- DOI
- https://doi.org/10.1109/ipc60965.2024.10799857
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- European Commission