THE EFFECT OF FLUORIDE AND INHIBITORS ON THE ANODIZED COPPER SURFACE
Two chemical solutions NH 4 F:H 2 O:C 3 H 8 O 3 (sol[Formula: see text] and NH 4 F:H 2 O:C 2 H 6 O 2 (sol[Formula: see text] with different fluoride ratios were used separately in an anodic process to study the morphological characteristics of the produced copper oxides. Glycerol and ethylene glycol were utilized as inhibitions to slow down the activity of fluoride ions. The rest of the anodization process parameters were constant. Scanning electron microscope (SEM) images showed the formation of Cu 2 O microcubes when sol 1 was used. The utilization of sol 2 produced octahedral Cu 2 O as well as cubes and spherical structures. The increase of NH 4 F in sol 1 led to a reduction in the volumes of Cu 2 O microcubes, and in sol 2 , it produced incomplete octahedral Cu 2 O. Since ethylene glycol has a lower viscosity than glycerol, copper corrodes more quickly in the presence of the former than in the latter. The findings indicate that sol 1 is experiencing a higher current flow than sol 2 . The relationship between current and time is semi-constant at low applied voltage, but the two curves behave differently when applying high voltage in the early stages.
Authors
- Mustafa Shakir Hashim (ORCID: https://orcid.org/0000-0002-0085-6795)
- Haitham Salih
Institutions
- Mustansiriyah University (IQ)
Publication Details
- Journal
- Surface Review and Letters
- Published
- 2024-12-20
- DOI
- https://doi.org/10.1142/s0218625x25501185
- Primary Topic
- Graphene and Nanomaterials Applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00