Characterization and reuse of SiC flakes generated during electrochemical etching of 4H-SiC wafers

Silicon carbide porous flakes are produced during the electrochemical etching (ECE) of n-doped 4H-SiC wafers. The differences in porosity between the Si-face and C-face allow for the adsorption of various dyes.

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Publication Details

Journal
Journal of Materials Chemistry A
Published
2024-12-19
DOI
https://doi.org/10.1039/d4ta07035f
Citations
4
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.83
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article

Characterization and reuse of SiC flakes generated during electrochemical etching of 4H-SiC wafers

Vanessa Spanò, M.L. Barcellona, Thomas Defforge, Maria Elena Fragalà et al.
4 citations
Journal of Materials Chemistry A
Silicon Carbide Semiconductor Technologies
0.83
article

Characterization and reuse of SiC flakes generated during electrochemical etching of 4H-SiC wafers

Vanessa Spanò, M.L. Barcellona, Thomas Defforge, Maria Elena Fragalà, Salvatore Scirè, Gaël Gautier, Roberto Fiorenza
article en
4 citations

Abstract

Silicon carbide porous flakes are produced during the electrochemical etching (ECE) of n-doped 4H-SiC wafers. The differences in porosity between the Si-face and C-face allow for the adsorption of various dyes.

Journal of Materials Chemistry AVol. 13(4)
Université de Tours (FR), Centre National de la Recherche Scientifique (FR), University of Catania (IT), Services déconcentrés d'appui à la recherche Val de Loire (FR), Institut National des Sciences Appliquées Centre Val de Loire (FR)
Clean water and sanitation
Openalex Percentile: Top 26%
Silicon Carbide Semiconductor Technologies
0.83
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Characterization and reuse of SiC flakes generated during electrochemical etching of 4H-SiC wafers — Vanessa Spanò, M.L. Barcellona, et al. · Journal of Materials Chemistry A (2024) | TGRS Research Map | TGRS