Enhancing High-Power-Density Converter Design: A Data-Driven Analysis of MOSFET and Heatsink Selection

MOSFETs are commonly used switching devices in high-power-density converters thanks to their fast-switching frequency. However, their on-state resistance and high switching frequency result in undesirable heat dissipation, which leads to thermal management challenges. To prevent device overheating, failure, and safety hazards, heatsinks for cooling are essential. This study aims to address the optimal combined selection of MOSFETs and heatsinks for designing high-power-density converters by analyzing extensive MOSFET and heatsink data from electronics distributors and utilizing data imputation to handle missing data related to MOSFET and heatsink specifications. This paper establishes a comprehensive data-driven model, supported by data imputation, that estimates the converters' power dissipation and temperature of MOSFETs and heatsinks based on design parameters including voltage levels, current levels, costs, and volumes. Predicting power dissipation and junction temperature under varying design parameters aids engineers in making suitable choices during the practical design process.