CFD Simulation On Solder Joints Wetting Properties For A Low And High Temperature Solder

Abstract The soldering process involves the ability of a melted solder to spread and adhere on a substrate to form a metallic bond driven by the physical and chemical properties of the system. Thus, studying solder joint wettability due to the effect of solder’s wetting and thermal properties is crucial. The primary objective of this project is to develop multiple CFD simulation models to simulate solder joint wetting properties for different solders and compare the numerical results with theoretical results. Afterwards, the most suitable simulation model will be determined based on the accuracy, functionality, advantages, and disadvantages of the model. Initially, the thermal properties and theoretical wetting properties of different solders will be obtained to design the simulation geometry and determine the simulation boundary conditions. Then, each of the developed simulation models will be implemented in ANSYS Fluent, and the simulation will be carried out to simulate the solder joint wetting properties by applying the VOF and melting & solidification CFD models and their corresponding boundary conditions. The results show that all the developed simulation models were able to accurately simulate the wetting properties of the solder joint. However, only the reflow soldering process model has the functionality to perform temperature dependence simulation and the potential to perform time dependence simulation. Hence, the most suitable simulation model is the reflow soldering process model.