Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor

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Publication Details

Journal
Korean Journal of Materials Research
Published
2024-11-27
DOI
https://doi.org/10.3740/mrsk.2024.34.11.529
Primary Topic
Advanced Memory and Neural Computing
Type
article
Field-Weighted Citation Impact
0.00

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article

Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor

Jae Pil Jung, Ji Won Park, Sung Jin Kim, C. H. Jung
3 links
Korean Journal of Materials Research
Advanced Memory and Neural Computing
article

Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor

Jae Pil Jung, Ji Won Park, Sung Jin Kim, C. H. Jung
article en

Abstract

No abstract available for this paper.
Korean Journal of Materials ResearchVol. 34(11)
University of Seoul (KR)
Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology
Industry, innovation and infrastructure
Openalex Percentile: Top 79%
Advanced Memory and Neural Computing
DOIOpen Access PDFOpenAlex
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Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor — Jae Pil Jung, Ji Won Park, et al. · Korean Journal of Materials Research (2024) | TGRS Research Map | TGRS