A 3-to-78-GHz Distributed Low-Noise Amplifier Incorporating High-Gain Differential <i>g</i>m Cells and Balanced Active Balun in a 65-nm CMOS

This article reports an ultrawide CMOS distributed low-noise amplifier (LNA) for ultrahigh-speed communications. The proposed LNA consists of a front single-end-to-differential distributed active balun and a subsequent differential distributed amplifier (DA). Various forms of parasitic capacitance that can degrade the high-frequency performance are carefully counteracted in this scheme. The distributed active balun is based on a cascode-cascade topology with full-band mismatch compensation techniques. The differential DA is built using a neutralized cascode amplifier, merged with inductive peaking and capacitive bootstrapping. Thanks to the use of these techniques, our scheme simultaneously achieves good results in terms of gain, noise figure (NF), and balance over an ultrawide bandwidth. The LNA prototype is designed in a 65-nm CMOS technology with an area of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.9\times 0.7$ </tex-math></inline-formula> mm2. The LNA scores a 13.7–16.9-dB gain from 3 to 78 GHz while integrating all supply networks. The measured group delay is 45–91 ps over 3–78 GHz, and the NF is 5.5–7.8 dB up to 50 GHz. The differential outputs show a good balance of <0.37-dB gain error and <3.8° phase error over the full bandwidth. The chip core consumes a 72-mA current from a 1.2-V supply, and the total power consumption of the chip is 170.4 mW including the consumption on the 50-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\Omega $ </tex-math></inline-formula> load resistors.

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Publication Details

Journal
IEEE Transactions on Microwave Theory and Techniques
Published
2024-12-18
DOI
https://doi.org/10.1109/tmtt.2024.3514684
Citations
2
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
0.42

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article

A 3-to-78-GHz Distributed Low-Noise Amplifier Incorporating High-Gain Differential gm Cells and Balanced Active Balun in a 65-nm CMOS

Tianxiang Wu, Junyan Ren, Lihe Nie, Jincheng Zhang et al.
2 citations
IEEE Transactions on Microwave Theory and Techniques
Radio Frequency Integrated Circuit Design
0.42
article

A 3-to-78-GHz Distributed Low-Noise Amplifier Incorporating High-Gain Differential gm Cells and Balanced Active Balun in a 65-nm CMOS

Tianxiang Wu, Junyan Ren, Lihe Nie, Jincheng Zhang, Shunli Ma, Yong Chen
article en
2 citations

Abstract

This article reports an ultrawide CMOS distributed low-noise amplifier (LNA) for ultrahigh-speed communications. The proposed LNA consists of a front single-end-to-differential distributed active balun and a subsequent differential distributed amplifier (DA). Various forms of parasitic capacitance that can degrade the high-frequency performance are carefully counteracted in this scheme. The distributed active balun is based on a cascode-cascade topology with full-band mismatch compensation techniques. The differential DA is built using a neutralized cascode amplifier, merged with inductive peaking and capacitive bootstrapping. Thanks to the use of these techniques, our scheme simultaneously achieves good results in terms of gain, noise figure (NF), and balance over an ultrawide bandwidth. The LNA prototype is designed in a 65-nm CMOS technology with an area of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1.9\times 0.7$ </tex-math></inline-formula> mm2. The LNA scores a 13.7–16.9-dB gain from 3 to 78 GHz while integrating all supply networks. The measured group delay is 45–91 ps over 3–78 GHz, and the NF is 5.5–7.8 dB up to 50 GHz. The differential outputs show a good balance of <0.37-dB gain error and <3.8° phase error over the full bandwidth. The chip core consumes a 72-mA current from a 1.2-V supply, and the total power consumption of the chip is 170.4 mW including the consumption on the 50-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\Omega $ </tex-math></inline-formula> load resistors.

IEEE Transactions on Microwave Theory and TechniquesVol. 73(7)
Fudan University (CN), Tsinghua University (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 36%
Radio Frequency Integrated Circuit Design
0.42
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