Mechanistic insights into waterjet-guided laser grooving of silicon: Impact of ablation dynamics, oxide formation, and thermal stress

Waterjet-guided laser machining of silicon offers precision with minimal heat-affected zones (HAZs), but understanding the mechanisms behind laser-material interactions remains essential. This study first utilizes orthogonal experiments to reveal fundamental relationships between processing parameters (scanning cycle, laser fluence, scanning velocity, and waterjet pressure) on groove depth and the depth-to-HAZ ratio. These findings guide the in-depth investigation of laser-material mechanisms. The results indicate that the ablation rate decreases with increasing scanning cycles, a phenomenon primarily attributed to the different absorption rates of 532 nm laser light between silicon and silicon dioxide. This conclusion is supported by x-ray photoelectron spectroscopy(XPS) results, which reveal that the accumulation of silicon dioxide occurs as the scanning cycles increase. Additionally, a near-linear relation between the ablation rate and laser fluence is observed, as the ablated area is continuously exposed to high laser intensity regions. However, increasing laser fluence also leads to diminished processing quality due to greater thermal deformation in non-ablating regions. Last, increased scanning velocity is found to cause rougher surfaces, as insufficient heat diffusion leads to higher thermal stress and results in micro-crack formations. The results provide a detailed understanding of the laser-induced transformations in the material and highlight optimal conditions for reducing thermal damage while maintaining machining efficiency. This study advances the field of laser processing by offering insights into the mechanisms governing oxide formation, thermal cracking, and material deformation during silicon grooving, providing the foundation for future exploration of laser-material interaction dynamics.