Characterization of electrolytically developed copper filled epoxy adhesive for space applications

The pursuit of advanced materials for space applications accelerates the development of new materials that exhibits excellent thermal, mechanical, and electrical properties under extreme environments. This study focuses on optimizing copper loading levels within epoxy matrices (ranging from 35 % to 55 %) to evaluate how variations in copper content impact the composite's physico-chemical stability, thermal conductivity, controlled outgassing properties and adhesive strength. In addition, this study also discusses the result of specific modifications of epoxy resin system aiming to assess the suitability of resultant composites for space applications. Characterization involved sample preparation from each set, followed by various testing and analysis methods including Thermogravimetric Analysis (TGA), Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR), Lap shear strength measurement, outgassing property evaluation, and thermal conductivity testing. As a result, this research findings suggest that 50 % copper filled epoxy composites shows potential as good thermal conductive adhesives for space applications. • Cured composites are chemically and thermally stable. • Cured composites are free from agglomeration of copper powder. • Copper filler can be utilized to prepare thermally conductive epoxy-based adhesives for space use.