Mitigation of 1-Row Hammer in BCAT Structures Through Buried Oxide Integration and Investigation of Inter-Cell Disturbances
Dynamic random-access memory (DRAM) is crucial for high-performance computing due to its speed and storage capacity. As the demand for high-capacity memory increases, DRAM has adopted a scaled-down approach for the next generation. However, the reduced distance between cells leads to electrical interference, known as the 1-row Hammer effect, which degrades DRAM performance and poses security risks. Therefore, the 1-row Hammer effect is a critical issue in current DRAM technology. In this study, we investigate the principles and impact of the 1-row Hammer phenomenon on DRAM. The 1-row Hammer effect can cause two types of failures: D0 and D1. We focus on D0 failures, which occur when stored data transition from 0 to 1 due to repeated accesses. This phenomenon involves the capture and diffusion of electrons, influenced by interfacial traps and device structures. To investigate the D0 failure, we simulated the 1-row Hammer effect using a mixed-mode approach to examine its effects on interfacial traps and device structure changes. This study aims to improve our understanding of row Hammer and suggests a mitigation strategy using buried oxide. The proposed structure mitigates the D0 failure by approximately 25%, effectively improving the security and reliability of DRAM.
Authors
- Yeon‐Seok Kim
- Min-Woo Kwon (ORCID: https://orcid.org/0000-0002-6725-1969)
Institutions
- Seoul National University of Science and Technology (KR)
- Gangneung–Wonju National University (KR)
Publication Details
- Journal
- Electronics
- Published
- 2024-12-13
- DOI
- https://doi.org/10.3390/electronics13244936
- Citations
- 1
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.21
Funders
- National Research Foundation
- National Research Foundation of Korea
- Ministry of Education, India
- Ministry of Science and ICT, South Korea