Extreme Temperature Automotive Testing

How to guarantee Hot and Cold junction temperatures during production testing of Integrated Circuits is challenging. We analyze findings for improved IC junction temperature regulation during test for AEC-Q100 grade 0 devices by using passive and active thermal regulation, special materials and components, and thermal zoning. Passive Regulation is achieved by Socket and PCB design and by the use of Purge Covers, Heat Shields, and Daughter Boards. Active Thermal Regulation uses PTC thermistors for thermal conditioning and maximizes handler capabilities. Special materials and components are showcased such as high temp photomos and mechanical relays, higher MOT UL rated FR4, high temp ceramic and Conductive Polymer Hybrid capacitors, and improvements in resistor power ratings. We also explore techniques to know junction temp such as diode calibration, BTT golden DUTs and in-package RTD calibration. Finally, we discuss lessons learned in production testing such as contact issues, setup tests, spike checks, and minimum best practice test techniques like Delta Iq, JVT, NVM verification, tri-temp read margin, and post leakage current measurements.