Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint

A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the microstructure of the composite solder and mitigate the coarsening of Bi-phase segregation. At 0.75 weight percent Ni nanoparticle content, the composite solder’s tensile strength is 59.7 MPa and its elongation is 54.6%, both of which are noticeably greater than those of the base solder. When the thermal loading time is 576 h, the shear strength of the composite solder joint is 25.5 MPa, which is 30.1% higher than that of the base solder joint. This study reveals that the shear fracture path shifts from the boundary region between the solder seam and the IMC layer to the IMC layer itself. Concurrently, the fracture mode evolves from a mix of brittle–ductile fracture, characterized by quasi-cleavage, to a predominantly brittle fracture, marked by numerous “rock candy-like” cross-sectional features and secondary cracking. Adding Ni nanoparticles to the Sn58Bi composite solder/Cu solder junction can significantly extend its service life.