Research on wafer warping monitoring based on digital twin

In order to solve the problem of real-time synchronous display of wafer warping monitoring, a wafer warping monitoring method based on DTing is proposed to realize the interactive symbiosis of wafer physical space and virtual space. The wafer warping monitoring system based on the five-dimensional DT model is constructed, including digital space construction, MCC-DT data drive, twin data transmission and management, and service system. The physical wafer warping is simulated by displacement loading, and the virtual wafer warping is obtained synchronously by the established twin system. The experimental results show that the accuracy of the proposed system can reach 90%, and provide help for wafer digital manufacturing.