Research on Integrated Circuit Packaging Testing Technology Based on Large Language Model

The integrated circuit packaging testing technology is highly demanding, and the task is arduous. The existing sorting efficiency of integrated circuit packaging testing is low, and it is difficult to detect unqualified products for rapid centralized processing. There is an urgent need for upgrading and improvement. This paper proposes to fine-tune the large language model and establish a large language model monitoring system for integrated circuit packaging and inspection, embedding it in a CNC system, thereby providing support for the intelligent transformation and upgrading of integrated circuit production and processing.