Preparation of Bumps Using a Novel Photosensitive Conductive Polymer Material for Micro-LED Display Application

Micro-light-emitting diode (Micro-LED) is increasingly favored due to their significant advantages in the performance of emerging augmented reality (AR) or virtual reality (VR) displays. A key process of single-chip integration technology in high-density micro displays is the interconnection process, which is closely related to the quality of display devices. The traditional chip interconnection is mainly achieved by preparing metal-based bump, which requires metal evaporation after photolithography, increases the process flow complexity, and poses a risk of photoresist peeling off. To solve these problems, we use a new type of photosensitive conductive polymer material to prepare bump that has conductivity and can directly interconnect chips vertically. Therefore, this method can eliminate the process of metal evaporation and reduce experimental risks. The results indicate that by optimizing the process parameters, bumps with high uniformity can be successfully prepared. This material can simplify the process flow and improve the success of subsequent vertical interconnection steps.