Research on System Fan Shroud Used for Heat Dissipation in Graphics Units

To improve heat dissipation in graphics units, we propose installation of system fan shroud and verify the heat dissipation system. Firstly, system fan shroud suitable for the test computing system is made by 3-Dimensional printing, and thermal-fluid-coupled Finite Element Model is built according to computing system's geometry and material parameters. Secondly, the proposed heat dissipation system is verified by thermometer measurement and Finite Element Model calculation. Finally, influence of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$P_{\max}$</tex> and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$Q_{\max}$</tex> in P-Q curve of system fans, graphics units Total Board Power, and different channelization is calculated by Finite Element Model. It is concluded that both thermal-fluid-coupled Finite Element Model and measurement consistently show “'20°C temperature drop after installation of system fan shroud; Besides, when maximum static pressure is fixed at 19 Pa, the lowest GPU temperature (51.21 °C) occurs at 34 m” /s maximum airflow volume; calculation with temperature-independent air properties show that GPU temperature is linearly related to TBP, and curve inclination <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$k=0.0775$</tex>. The calculation, analysis and conclusion of our work can provide reference for heat dissipation strategies in computing systems.