Research on the Effect of Heating Temperature Rise on the Reliability of CSOP Solder Joints

To study the effect of heating temperature rise on the reliability of device solder joints, a typical Ceramic Small Outline Package (CSOP) device was selected. A test board was designed and the actual temperature rise of the CSOP devices during the temperature cycling test was obtained through experiments. To compare the thermal fatigue life of the CSOP devices under powered and unpowered conditions, finite element simulation models were established. The maximum stress value and maximum strain value under two conditions were compared and studied. The research results show that the heating temperature rise when devices are powered on has an impact on the reliability of CSOP devices solder joints.