Multiphysics Analysis on 2.5D Chiplet Structures

In recent years, as Moore's Law is approaching its physical limit, chiplet technology as a solution that can extend Moore's Law has been emphasized by the industry. However, there are still many problems with its widespread use. In this article, a 2.5D chiplet structure was built and then the structure was analyzed for coupled thermal-stress-electric multi-physical fields using COMSOL software. The following conclusions can be reached. 1) Due to the mismatch of the coefficients of thermal expansion of the materials, at high temperatures, the interface between the two materials will generate stresses, leading to warping of the entire structure and affecting the reliability of the structure. 2) Changes in the electromagnetic properties of materials caused by high temperatures lead to phenomena such as spectrum offset in devices placed on silicon interposer.