Optimization of Liquid Cooling System Structure

The increase in chip integration and power consumption per unit area significantly raises the surface and internal temperatures of chips. A microchannel heat sink effectively addresses the heat dissipation issues of high-performance chips. Traditional rectangular microchannel heat sinks have a limited convection area and poor heat dissipation performance. Three types of manifold microchannel radiators were designed using SolidWorks software: partially cylindrical, partially square, and fully square. Numerical simulations using Fluent indicate that under a heat flux of 300 W/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>, the cylindrical heat sink demonstrates excellent comprehensive heat dissipation performance across different mass flow conditions. It shows higher average convective heat transfer coefficients and Nusselt numbers, with lower pressure drops and friction factors.