Numerical Optimisation of Air-cooled Heat Sink Geometry to Improve Temperature Gradient of Power Semiconductor Modules

This paper discusses the numerical analysis and optimisation of a conventional air-cooled heat sink having an insignificant geometrical modification to reduce the temperature gradient of power semiconductors installed on the top surface of the heat sink. Using the numerical approach, the influence of the geometry modification on the thermal performance of the heat sink was thoroughly analysed. The geometry modification applied to the heat sink is based on the partial removal of the central fins at the air flow intake in the form of a triangle and the integration of a guide plate to provide a reduction in the temperature difference across the heat sink surface. These modifications do not expand the heat sink footprint or make the manufacturing process complicated. The optimised design exhibited a considerably reduced temperature gradient between the power electronic modules. The temperature difference between power semiconductors operating with a power loss of 100 W per module is reduced from 3.779°C (for the unmodified benchmark model) to 0.0018°C. The study findings contribute to the advancement of thermal solutions in power electronics by presenting a manufacturable, scalable, and efficient heat sink design that addresses the industry demand for sustainable thermal regulation.