A TEC-Based Thermal Solution for Quantum Current Sensors in Grid Applications

This paper investigates the heat dissipation problem of a diamond NV quantum current sensor with an integrated laser diode in practical applications. Firstly, the heat generation of the internal components of the sensor is evaluated through experimental analysis. The findings indicate that the sensor with this structure is susceptible to heat accumulation during high-power operation, which subsequently affects the sensor’s performance. To address this issue, a heat dissipation scheme utilizing a thermal electric cooler (TEC) in conjunction with heat sink fins is proposed, and the performance of two distinct heat sink fins is evaluated. The experimental results demonstrate that the heat sink fins with heat pipes exhibit an enhanced heat dissipation effect while maintaining a compact size and minimal weight. Furthermore, in order to reduce the magnetic field interference caused by the TEC, a distal-mounted TEC scheme is designed. However, this scheme exhibits a lower heat dissipation efficiency compared to the proximal-mounted TEC scheme at 2W heating power. This study proposes a solution for the heat dissipation design of this type of quantum current sensor, which provides a reliable method for its future application in power grid systems.