Three-Dimensional Nondestructive Characterization of Extrinsic Frank-Type Stacking Faults in 4H-SiC Crystals

The luminescence detection technique is one of the most commonly used NDT techniques for detecting stacking faults in 4H-SiC crystals. Commonly used detection methods, such as photoluminescence (PL) and cathodoluminescence (CL), have a relatively shallow detection depth for 4H-SiC crystals. To overcome these shortcomings, in this study, we used two-photon fluorescence microscopy (2PPL) to qualitatively and quantitatively observe the three-dimensional morphology of Frank-type stacking faults for the first time on 4H-SiC crystals. The comparison reveals that the conventional PL and CL cannot accurately detect the complete morphology of stacking faults due to the limitation of the detection depth, nor can they detect the defects of stacking faults existing at a certain depth inside the crystal. The experimental results show that 2PPL can break through the traditional detection depth limitation, and the detection depth of this experiment reaches 130 μm, which is intuitive and accurate for the three-dimensional qualitative and quantitative characterization of the stacking faults on 4H-SiC crystals. We found errors in confocal PL detection of Z-axis depth during the experiments of confocal PL detection and explained the reasons for the errors. This work also analyzes the spatial growth characteristics of the detected Frankish stacking defects.

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Publication Details

Journal
Crystal Growth & Design
Published
2024-12-10
DOI
https://doi.org/10.1021/acs.cgd.4c00636
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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article

Three-Dimensional Nondestructive Characterization of Extrinsic Frank-Type Stacking Faults in 4H-SiC Crystals

Haotian Li, Qingbo Li, Yanmin Zong, Xian Zhao et al.
Crystal Growth & Design
Silicon Carbide Semiconductor Technologies
article

Three-Dimensional Nondestructive Characterization of Extrinsic Frank-Type Stacking Faults in 4H-SiC Crystals

Haotian Li, Qingbo Li, Yanmin Zong, Xian Zhao, Yan Li, Yongfu Li, M. Wang, Mingyang Wei
article en

Abstract

The luminescence detection technique is one of the most commonly used NDT techniques for detecting stacking faults in 4H-SiC crystals. Commonly used detection methods, such as photoluminescence (PL) and cathodoluminescence (CL), have a relatively shallow detection depth for 4H-SiC crystals. To overcome these shortcomings, in this study, we used two-photon fluorescence microscopy (2PPL) to qualitatively and quantitatively observe the three-dimensional morphology of Frank-type stacking faults for the first time on 4H-SiC crystals. The comparison reveals that the conventional PL and CL cannot accurately detect the complete morphology of stacking faults due to the limitation of the detection depth, nor can they detect the defects of stacking faults existing at a certain depth inside the crystal. The experimental results show that 2PPL can break through the traditional detection depth limitation, and the detection depth of this experiment reaches 130 μm, which is intuitive and accurate for the three-dimensional qualitative and quantitative characterization of the stacking faults on 4H-SiC crystals. We found errors in confocal PL detection of Z-axis depth during the experiments of confocal PL detection and explained the reasons for the errors. This work also analyzes the spatial growth characteristics of the detected Frankish stacking defects.

Crystal Growth & DesignVol. 24(24)
Shandong University (CN)
National Key Research and Development Program of China
Climate action
Openalex Percentile: Top 80%
Silicon Carbide Semiconductor Technologies
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Three-Dimensional Nondestructive Characterization of Extrinsic Frank-Type Stacking Faults in 4H-SiC Crystals — Haotian Li, Qingbo Li, et al. · Crystal Growth & Design (2024) | TGRS Research Map | TGRS