ELECTROCHEMICAL CORROSION EVALUATION OF SnSb ELECTRODEPOSITED COATINGS

SnxSb(1−x) coatings were electrodeposited from 1ChCl:2EG on copper. The corrosion resistance of the electrodeposits was evaluated in 0.1 mol dm-3 of NaCl. The characterization was performed by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), and X-ray diffraction (XRD). Voltammetric profiles showed that the electrodeposition potential shifted towards less positive values with increasing Sb3+ concentration. SEM images revealed that the coatings exhibited grains and clusters. EDS analyses showed that the Sb content increased with the Sb3+ concentration. XRD results indicated the formation of the SbSn phases such as Cu2Sb, Cu6Sn5, and Cu6(Sn,Sb)5. The potentiodynamic polarization (PP) curves showed that Sn and Sn77Sb23 presented a passive potential region, while Sn37Sb63 had an active dissolution in the electrolyte. Immersion tests were performed for 24 h and XRD results revealed Cu, Sn, SnO, SbSn and Sb2O4 phases. Considering 48 h, Cu, CuSn, SnO2 and SnSb phases were identified. The polarization resistance values of 4.60, 14.69 and 1.81 kΩ cm2 were achieved for Sn, Sn77Sb23, and Sn37Sb63, respectively. The EIS results suggested that adding Sb3+ improves corrosion resistance for SnSb samples with higher Sn content. For Sn77Sb23, the charge transfer resistance was 10.5 kΩ cm2, for Sn and Sn37Sb63 1.15 and 1.46 kΩ cm2, respectively.