Preparation of Ionic Polymer–Metal Composites Using Copper Electrodes via Magnetron Sputtering

The effective treatment of the surface electrode is the core technology of an ionic polymer–metal composite (IPMC), and its preparation significantly affects the driving performance of the IPMC. Copper, which is inexpensive and has excellent electrical conductivity, was selected as the surface electrode material, and copper electrode IPMCs (Cu-IPMCs) were prepared via magnetron sputtering. Orthogonal experiments were performed to optimize the parameters of the preparation process. The indices of the deformation angle and surface resistance were used, and the sample electrodes’ surface morphology and elemental content were analyzed. The results showed that sputtering pressure was the major factor affecting two indices. The Cu-IPMC, prepared at a sputtering pressure of 0.9 Pa, sputtering time of 35 min, argon flow rate of 30 sccm, and sputtering power of 150 W, had a more minor surface resistance and a larger deformation angle under continuous direct current boosting. It required a sputtering time of 1.2 h, which was more than 10 times shorter than its chemically plated counterpart. It exhibited surface resistance in the 2–3 Ω/cm range, which was 23 times smaller than chemically plated platinum.