High Strength and Dynamically Tunable Adhesion Enabled by Composite Micropillar Arrays Fabricated via Solvent‐Assisted Molding

Abstract The ability to control adhesion on demand is important for a broad range of applications, including the gripping and manipulation of objects in robotics and manufacturing, and the temporary attachment of wearable devices. Despite recent advances in tunable adhesive materials, most existing solutions have modest adhesion strength and are limited by a compromise between the maximum and minimum adhesion, where increased strength prevents the release of lighter objects. To overcome these challenges, thermally responsive polymers, which can exhibit both high stiffness and a large reduction in stiffness via heating, have the potential to enable strong and tunable adhesion. Here, a microstructured composite adhesive with high strength (>2 MPa) and dynamically tunable adhesion (16×) is realized using a solvent‐assisted molding technique. The adhesive consists of an array of composite micropillars whose small scale and material composition enable strong and tunable adhesion. While thermally actuated systems often have slow response times, it is shown that miniaturization allows response times to be reduced to <1s for heating and <10s for cooling. These strong, fast, and dynamically tunable adhesives offer advantages over existing solutions and can be manufactured for practical adoption through the scalable solvent‐assisted molding technique.