Revolutionizing wearable technology: advanced fabrication techniques for body-conformable electronics
With the increasing demand for wearable electronic products, there is a pressing need to develop electronic devices that seamlessly conform to the contours of the human body while delivering excellent performance and reliability. Traditional rigid electronic fabrication technologies fall short of meeting these requirements, necessitating the exploration of advanced flexible fabrication technologies that offer new possibilities for designing and fabricating flexible and stretchable electronic products, particularly in wearable devices. Over time, the continuous development of innovative fabrication techniques has ushered in significant improvements in the design freedom, lightweight, seamless integration, and multifunctionality of wearable electronics. Here, we provide a comprehensive overview of the advancements facilitated by advanced fabrication technology in wearable electronics. It specifically focuses on key fabrication methods, including printed electronics fabrication, soft transfer, 3D structure fabrication, and deformation fabrication. By highlighting these advancements, it sheds light on the challenges and prospects for further development in wearable electronics fabrication technologies. The introduction of advanced fabrication technologies has revolutionized the landscape of wearable/conformable electronics, expanding their application domains, streamlining system complexity associated with customization, manufacturing, and production, and opening up new avenues for innovation and development of body-conformable electronics.
Authors
- Kai Jiang (ORCID: https://orcid.org/0000-0001-9006-0514)
- Qilin Hua (ORCID: https://orcid.org/0000-0002-5269-5532)
- Guozhen Shen (ORCID: https://orcid.org/0000-0002-9755-1647)
- Haotian Li (ORCID: https://orcid.org/0000-0003-1528-6083)
- Ruilai Wei (ORCID: https://orcid.org/0009-0004-6400-2803)
- Zhongming Chen (ORCID: https://orcid.org/0000-0002-9628-3505)
Institutions
- Beijing Institute of Technology (CN)
- Beijing Electronic Science and Technology Institute (CN)
- Chinese PLA General Hospital (CN)
Publication Details
- Journal
- npj Flexible Electronics
- Published
- 2024-12-04
- DOI
- https://doi.org/10.1038/s41528-024-00370-8
- Citations
- 81
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 14.94
Funders
- British Columbia Innovation Council
- National Natural Science Foundation of China
- Beijing Institute of Technology
- Beijing Institute of Technology Research Fund Program for Young Scholars
- National Key Research and Development Program of China
- Fundamental Research Funds for the Central Universities