Uncovering Real GPU NoC Characteristics: Implications on Interconnect Architecture
A critical component of high-throughput processors such as GPUs is the network-on-chip (NoC) that interconnects the large number of cores and the memory partitions together. In this work, we provide a detailed analysis, in terms of latency and bandwidth, of real GPU NoC across several generations of modern NVIDIA GPUs. Our analysis identifies how non-uniform latency exists between the cores and the memory partitions based on their physical location in the GPU. The non-uniformity can result in up to approximately 70 % difference in on-chip latency. In comparison, the bandwidth provided from the cores to the memory partitions is approximately uniform. However, recent GPUs that consist of multiple GPU “partitions” present different on-chip latency and bandwidth characteristics when communicating between the partitions. Based on our analysis of real GPU interconnect, we discuss potential implications including its impact on timing used in side-channel attacks as well as NoC microarchitectures. We show how the non-uniform latency can be exploited in a timing side-channel attack within a GPU as the core location impacts performance (or timing). In addition, proper understanding (and proper assumptions) of GPU NoC is critical to ensure a network that does not bottleneck the overall system performance.
Authors
- Cristian E. La Rocca (ORCID: https://orcid.org/0000-0002-8477-6775)
- Zhigang Jin (ORCID: https://orcid.org/0000-0001-5777-569X)
- Tor M. Aamodt (ORCID: https://orcid.org/0000-0003-1161-692X)
- Ali Bakhoda
- Hans Kasan (ORCID: https://orcid.org/0000-0002-8828-8058)
- Minsoo Rhu (ORCID: https://orcid.org/0000-0003-3303-8681)
- Jiho Kim (ORCID: https://orcid.org/0000-0002-3940-1659)
- John Kim (ORCID: https://orcid.org/0000-0003-3958-3891)
Institutions
- Microsoft (United States) (US)
- University of British Columbia (CA)
- Korea Advanced Institute of Science and Technology (KR)
- Bellevue Hospital Center (US)
Publication Details
- Published
- 2024-11-02
- DOI
- https://doi.org/10.1109/micro61859.2024.00070
- Citations
- 11
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 2.30