Understanding Sn Whisker Growth Mechanisms and Influencing Factors
Tin whiskers are microscopic filamentary structures that grow spontaneously from tin and tin-alloy surfaces. They pose significant reliability risks in electronic devices due to their potential to cause short circuits. In recent years, significant research has sought to develop an understanding of the underlying mechanisms governing tin whisker formation and to devise effective mitigation strategies. This review synthesizes key findings from a series of basic studies, each seeking to provide unique insights into the complex nature of tin whisker growth.
Authors
- Erika R. Crandall
- Chad L. Rodekohr
- E. K. Snipes
- Michael J. Bozack (ORCID: https://orcid.org/0000-0001-7163-2599)
- George T. Flowers (ORCID: https://orcid.org/0000-0002-7465-1055)
- Elizabeth Gainey
Institutions
- Auburn University (US)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/holm56222.2024.10768387
- Citations
- 4
- Primary Topic
- Labor Movements and Unions
- Type
- article
- Field-Weighted Citation Impact
- 3.42