Series-Fed Microstrip Patch Antenna Array with Additive-Manufactured Foldable Honeycomb-Shaped Substrate

This paper presents a novel foldable S-band microstrip patch antenna array operating in the 2.4-2.45 GHz band. The substrate is designed to allow the array to be folded and arranged in tiles, forming a versatile, reconfigurable antenna array. Additive manufacturing is used to fabricate the substrate for ease of fabrication and flexibility in its design. The major challenge in this type of design is creating a proper method of feeding the elements while maintaining the array's optimal performance. A novel hinge design that can hold a coaxial cable for the series-fed array is introduced. The hinge provides the capability of folding the array from a flat orientation into various folded orientations. In this paper, a 2 × 1 microstrip array unit is presented as proof of concept. The antenna was fabricated and measured, and the results of the measurements are in close agreement with the simulations. The antenna can provide a gain as high as 7.72 dBi in flat conditions.