Analysis of Test Environment Configuration for High-Speed Link Chip Measurement

This paper presents an analysis of a test channel environment designed for high-speed serial links. The microstrip line channel was fabricated using a 4-layer FR-4. Using this environment, various components susceptible to impedance mismatching were fabricated to compare signal integrity. The bonding wire length, microstrip line width, and RF connector footprint were constructed, followed by measurements of the S-parameters and TDR impedance.