Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing

Process, Voltage, Temperature (PVT) variations impede the test generation for Small Delay Faults (SDFs) significantly as test patterns effective for one circuit instance may not be valid for a different one. Temperature-induced timing variations in FinFET and Gate-All-Around (GAA) technologies are especially severe due to temperature fluctuations and self-heating. Depending on the supply voltage, they show the Temperature Effect Inversion (TEI) which describes the increase of the circuit speed with increasing temperature. The Zero Temperature Coefficient (ZTC) specifies a supply voltage where TEI approaches 0, and the optimal voltage is determined, such that the effects of temperature-induced variability are minimized. Simulation results are reported, which demonstrate that test generation at the ZTC voltage leads to higher fault coverage of SDFs while using significantly less test patterns.

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Publication Details

Published
2024-11-03
DOI
https://doi.org/10.1109/itc51657.2024.00013
Citations
4
Primary Topic
VLSI and Analog Circuit Testing
Type
article
Field-Weighted Citation Impact
1.96
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article

Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing

Hanieh Jafarzadeh, Hans-Joachim Wunderlich, Sybille Hellebrand, Hussam Amrouch et al.
4 citations
VLSI and Analog Circuit Testing
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article

Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing

Hanieh Jafarzadeh, Hans-Joachim Wunderlich, Sybille Hellebrand, Hussam Amrouch, Jan Dennis Reimer, Florian Klemme
article en
4 citations

Abstract

Process, Voltage, Temperature (PVT) variations impede the test generation for Small Delay Faults (SDFs) significantly as test patterns effective for one circuit instance may not be valid for a different one. Temperature-induced timing variations in FinFET and Gate-All-Around (GAA) technologies are especially severe due to temperature fluctuations and self-heating. Depending on the supply voltage, they show the Temperature Effect Inversion (TEI) which describes the increase of the circuit speed with increasing temperature. The Zero Temperature Coefficient (ZTC) specifies a supply voltage where TEI approaches 0, and the optimal voltage is determined, such that the effects of temperature-induced variability are minimized. Simulation results are reported, which demonstrate that test generation at the ZTC voltage leads to higher fault coverage of SDFs while using significantly less test patterns.

University of Stuttgart (DE), Paderborn University (DE)
Climate action
Openalex Percentile: Top 12%
VLSI and Analog Circuit Testing
1.96
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