Wafer-level Packaging Platform for MEMS Sensor Applications

This paper reviews wafer-level packaging(WLP) processes of Si interposer, Cu-Sn eutectic bonding of Si-Si and anodic bonding of Si-Glass and getter materials that can be applied on MEMS sensors maintaining high vacuum and long-term reliability. This WLP technology can be applied to existing MEMS sensors such as multi-gas sensors, infrared sensors and inertial sensors which can achieve low cost and small form factor. Recently, the scope of application of WLP technology is expanding to the field of quantum sensors, and we would like to introduce related application fields.