Signal Shifting-based Reusable Redundant TSV Structure for Infrastructure TSV

Through-Silicon Vias (TSVs) are widely used as a solution to solve interconnection and power delivery issues of 3D integrated circuits. However, as manufacturing technology becomes finer, the reliability of TSVs has emerged as a significant challenge. This paper proposes a signal shifting-based reusable redundant TSV structure for infrastructure TSVs. Unlike conventional approaches where redundant TSVs left after repairs in signal-shifting structures remain unused, the proposed structure enables their utilization for repairing infrastructure TSVs. By ensuring that the proposed structure does not impact signal TSVs while utilizing redundant TSVs for infrastructure TSV repairs, it significantly enhances the reliability of semiconductors.