Development of Conductor Laminated Insulation Sheet for High Withstand Voltage Double-Sided Direct Cooling Power Module
Authors
- Akira Hyogo
- Takeshi Tokuyama (ORCID: https://orcid.org/0000-0002-9400-8729)
- Junpei Kusukawa
- Nobutake Tsuyuno
- Kinya Nakatsu
- Akira Matsushita (ORCID: https://orcid.org/0000-0002-7547-0782)
- Toshiaki Ishii (ORCID: https://orcid.org/0000-0002-4865-5124)
Institutions
- Tokyo University of Science (JP)
- Hitachi (Japan) (JP)
Publication Details
- Journal
- Journal of The Japan Institute of Electronics Packaging
- Published
- 2024-11-29
- DOI
- https://doi.org/10.5104/jiep.jiep-d-24-00034
- Primary Topic
- Engineering Applied Research
- Type
- article
- Field-Weighted Citation Impact
- 0.00