PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis

Thermal issues are becoming increasingly critical due to rising power densities in high-performance chip design. The need for fast and precise full-chip thermal analysis is evident. Although machine learning (ML)-based methods have been widely used in thermal simulation, their training time remains a challenge. In this article, we proposed a novel physics-informed separation of variables solver (PISOV) to significantly reduce training time for fast full-chip thermal analysis. Inspired by the recently proposed ThermPINN, we employ a least-square regression method to calculate the unknown coefficients of the cosine series. The proposed PISOV method combines physics-informed neural network (PINN) and separation of variables (SOVs) methods. Due to the matrix-solving method of PISOV, its speed is much faster than that of ThermPINN. On top of PISOV, we parameterize effective convection coefficients and power values for surrogate model-based uncertainty quantification (UQ) analysis by using neural networks, a task that cannot be accomplished by the SOV method. In the parameterized PISOV, we only need to calculate once to obtain all parameterized results of the hyperdimensional partial differential equations. Additionally, we study the impact of sampling methods (such as grid, uniform, Sobol, Latin hypercube sampling (LHS), Halton, and Hammersly) and hybrid sampling methods on the accuracy of PISOV and parameterized PISOV. Numerical results show that PISOV can achieve a speedup of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$245\times $ </tex-math></inline-formula>, and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10^{4}\times $ </tex-math></inline-formula> over ThermPINN, and PINN, respectively. Among different sampling methods, the Hammersley sampling method yields the best accuracy.

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Publication Details

Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Published
2024-11-27
DOI
https://doi.org/10.1109/tcad.2024.3506867
Citations
2
Primary Topic
Parallel Computing and Optimization Techniques
Type
article
Field-Weighted Citation Impact
0.98

Funders

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article

PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis

Junfa Mao, Sheldon X.-D. Tan, Liang Chen, Min Tang et al.
2 citations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Parallel Computing and Optimization Techniques
0.98
article

PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis

Junfa Mao, Sheldon X.-D. Tan, Liang Chen, Min Tang, Wenxing Zhu, Jianhua Zhang
article en
2 citations

Abstract

Thermal issues are becoming increasingly critical due to rising power densities in high-performance chip design. The need for fast and precise full-chip thermal analysis is evident. Although machine learning (ML)-based methods have been widely used in thermal simulation, their training time remains a challenge. In this article, we proposed a novel physics-informed separation of variables solver (PISOV) to significantly reduce training time for fast full-chip thermal analysis. Inspired by the recently proposed ThermPINN, we employ a least-square regression method to calculate the unknown coefficients of the cosine series. The proposed PISOV method combines physics-informed neural network (PINN) and separation of variables (SOVs) methods. Due to the matrix-solving method of PISOV, its speed is much faster than that of ThermPINN. On top of PISOV, we parameterize effective convection coefficients and power values for surrogate model-based uncertainty quantification (UQ) analysis by using neural networks, a task that cannot be accomplished by the SOV method. In the parameterized PISOV, we only need to calculate once to obtain all parameterized results of the hyperdimensional partial differential equations. Additionally, we study the impact of sampling methods (such as grid, uniform, Sobol, Latin hypercube sampling (LHS), Halton, and Hammersly) and hybrid sampling methods on the accuracy of PISOV and parameterized PISOV. Numerical results show that PISOV can achieve a speedup of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$245\times $ </tex-math></inline-formula>, and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10^{4}\times $ </tex-math></inline-formula> over ThermPINN, and PINN, respectively. Among different sampling methods, the Hammersley sampling method yields the best accuracy.

IEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsVol. 44(5)
University of California, Riverside (US), Shanghai University (CN), Shenzhen University (CN), Shanghai Jiao Tong University (CN), Fuzhou University (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 23%
Parallel Computing and Optimization Techniques
0.98
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