A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic material
A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resin counterparts, the cured DCPD-based resin demonstrates excellent thermal properties (<i>T</i><sub>g</sub> > 250 °C) and a low dissipation factor (0.0065 at 10 GHz), indicating its potential as a promising thermoset for high-performance electronic applications.
Authors
- Xin Ju (ORCID: https://orcid.org/0000-0003-3560-2821)
- Xu Li (ORCID: https://orcid.org/0000-0001-5589-2905)
- Long Zhang (ORCID: https://orcid.org/0000-0002-1945-4964)
- Yuqing Li (ORCID: https://orcid.org/0000-0003-0572-1619)
- Jianhua Li (ORCID: https://orcid.org/0009-0007-1329-4123)
- Jianming Zhang (ORCID: https://orcid.org/0000-0002-7752-1192)
- Shun Li (ORCID: https://orcid.org/0000-0002-9488-8279)
- Peng Zhao (ORCID: https://orcid.org/0009-0009-3398-0029)
- Shaoliang Jiang
Institutions
- Agency for Science, Technology and Research (SG)
- Jiangsu University (CN)
- Institute of Materials Research and Engineering (SG)
- Institute of New Materials (CN)
Publication Details
- Journal
- Chemical Communications
- Published
- 2024-11-26
- DOI
- https://doi.org/10.1039/d4cc05871b
- Primary Topic
- Synthesis and properties of polymers
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Ministry of Science and Technology of the People's Republic of China