Sidewall defect suppression of 620 nm AlGaInP-based red µLED devices using HfO<sub>2</sub> ALD passivation

Micro light-emitting diodes (µLEDs), crucial for advanced displays and communication systems, face efficiency challenges due to sidewall defects. This study investigates the impact of various passivation layers, including SiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>, and HfO<sub>2</sub>, on AlGaInP-based 620 nm red µLEDs. We fabricated devices with two mesa sizes and demonstrated that atomic layer deposition (ALD) passivation, especially with HfO<sub>2</sub>, significantly enhances performance. HfO<sub>2</sub> passivation shows improvement in external quantum efficiency (EQE) by up to 57.9% for a 13 × 20 µm<sup>2</sup> device size and 43.9% for a 26 × 40 µm<sup>2</sup> device size, compared to µLEDs with SiO<sub>2</sub>. Furthermore, it reduces surface recombination velocity (SRV) by 19.7% compared to SiO<sub>2</sub>. These findings highlight the potential of HfO<sub>2</sub>, via ALD, in advancing µLED technology by improving efficiency and performance through effective defect mitigation.

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Publication Details

Journal
Optics Letters
Published
2024-11-26
DOI
https://doi.org/10.1364/ol.543122
Citations
5
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.04

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article

Sidewall defect suppression of 620 nm AlGaInP-based red µLED devices using HfO2 ALD passivation

Ming-June Wu, Yi‐Tzu Tseng, Chao‐Hsin Wu, Yun-Cheng Yang et al.
5 citations
Optics Letters
Semiconductor materials and devices
1.04
article

Sidewall defect suppression of 620 nm AlGaInP-based red µLED devices using HfO2 ALD passivation

Ming-June Wu, Yi‐Tzu Tseng, Chao‐Hsin Wu, Yun-Cheng Yang, Chia-An Lee, Conway Yee, Natchanon Prechatavanich, Kuan‐Heng Lin, Theeradech Sutheebanjerd
article en
5 citations

Abstract

Micro light-emitting diodes (µLEDs), crucial for advanced displays and communication systems, face efficiency challenges due to sidewall defects. This study investigates the impact of various passivation layers, including SiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>, and HfO<sub>2</sub>, on AlGaInP-based 620 nm red µLEDs. We fabricated devices with two mesa sizes and demonstrated that atomic layer deposition (ALD) passivation, especially with HfO<sub>2</sub>, significantly enhances performance. HfO<sub>2</sub> passivation shows improvement in external quantum efficiency (EQE) by up to 57.9% for a 13 × 20 µm<sup>2</sup> device size and 43.9% for a 26 × 40 µm<sup>2</sup> device size, compared to µLEDs with SiO<sub>2</sub>. Furthermore, it reduces surface recombination velocity (SRV) by 19.7% compared to SiO<sub>2</sub>. These findings highlight the potential of HfO<sub>2</sub>, via ALD, in advancing µLED technology by improving efficiency and performance through effective defect mitigation.

Optics LettersVol. 50(2)
AU Optronics (Taiwan) (TW)
National Taiwan University, AU Optronics
Openalex Percentile: Top 22%
Semiconductor materials and devices
1.04
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