Effects of High-Temperature Treatments in Inert Atmosphere on 4H-SiC Substrates and Epitaxial Layers

Silicon carbide is a wide-bandgap semiconductor useful in a new class of power devices in the emerging area of high-temperature and high-voltage electronics. The diffusion of SiC devices is strictly related to the growth of high-quality substrates and epitaxial layers involving high-temperature treatment processing. In this work, we studied the thermal stability of substrates of 4H-SiC in an inert atmosphere in the range 1600-2000 °C. Micro-Raman spectroscopy characterization revealed that the thermal treatments induced inhomogeneity in the wafer surface related to a graphitization process starting from 1650 °C. It was also found that the graphitization influences the epitaxial layer successively grown on the wafer substrate, and in particular, by time-resolved photoluminescence spectroscopy it was found that graphitization-induced defectiveness is responsible for the reduction of the carrier recombination lifetime.

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Journal
Materials
Published
2024-11-25
DOI
https://doi.org/10.3390/ma17235761
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

Effects of High-Temperature Treatments in Inert Atmosphere on 4H-SiC Substrates and Epitaxial Layers

Massimo Davide Pirnaci, F. Pasquali, F. M. Gelardi, M. Cannas et al.
Materials
Silicon Carbide Semiconductor Technologies
article

Effects of High-Temperature Treatments in Inert Atmosphere on 4H-SiC Substrates and Epitaxial Layers

Massimo Davide Pirnaci, F. Pasquali, F. M. Gelardi, M. Cannas, F. Migliore, Andrea Brischetto, S. Agnello, D. Vecchio
article en

Abstract

Silicon carbide is a wide-bandgap semiconductor useful in a new class of power devices in the emerging area of high-temperature and high-voltage electronics. The diffusion of SiC devices is strictly related to the growth of high-quality substrates and epitaxial layers involving high-temperature treatment processing. In this work, we studied the thermal stability of substrates of 4H-SiC in an inert atmosphere in the range 1600-2000 °C. Micro-Raman spectroscopy characterization revealed that the thermal treatments induced inhomogeneity in the wafer surface related to a graphitization process starting from 1650 °C. It was also found that the graphitization influences the epitaxial layer successively grown on the wafer substrate, and in particular, by time-resolved photoluminescence spectroscopy it was found that graphitization-induced defectiveness is responsible for the reduction of the carrier recombination lifetime.

MaterialsVol. 17(23)
STMicroelectronics (Italy) (IT), University of Palermo (IT)
Openalex Percentile: Top 81%
Silicon Carbide Semiconductor Technologies
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