Preparation of Highly Transparent, Mechanically Enhanced, Antioxidant, and Biodegradable SPI/OAG Films via Synergistic Schiff Base Chemistry and Hydrogen Bonding Interactions

Excessive use of nondegradable plastics has raised environmental concerns, promoting the development of high-performance and eco-friendly materials. Polysaccharides and proteins, which offer advantages such as affordability and biodegradability, have potential in packaging but are limited in barrier and mechanical properties. Herein, using 30% acetic acid as a solvent for soy protein isolate (SPI) and introducing oxidized arabinogalactan (OAG) into the system, highly transparent (90%) and ultraviolet-shielding SPI/OAG flexible films were successfully prepared via Schiff base chemical cross-linking and hydrogen bond interactions between the components. The synergistic cross-linking of SPI and OAG effectively increased mechanical strength (tensile strength of 6.93 MPa), improved oxygen and water vapor barrier properties, and reduced swelling in the SPI/OAG films. The films exhibited good antioxidant activity (81.75% for ABTS and 85.34% for DPPH), effectively retarded browning and weight loss of strawberry and apple pieces, and were biodegradable in soil. The prepared SPI/OAG films had advantages over existing SPI-based films, including a uniform structure, low oxygen permeability, and excellent sustainability. This research demonstrates that SPI/OAG cross-linked films have strong potential in biodegradable packaging and as a substitute for petroleum-based plastics.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2024-11-22
DOI
https://doi.org/10.1021/acsami.4c17587
Citations
6
Primary Topic
Electrospun Nanofibers in Biomedical Applications
Type
article
Field-Weighted Citation Impact
1.04

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article

Preparation of Highly Transparent, Mechanically Enhanced, Antioxidant, and Biodegradable SPI/OAG Films via Synergistic Schiff Base Chemistry and Hydrogen Bonding Interactions

Zhulan Liu, Ren’ai Li, Hongzhuang Zhang, Mengqing Li et al.
6 citations
ACS Applied Materials & Interfaces
Electrospun Nanofibers in Biomedical Applications
1.04
article

Preparation of Highly Transparent, Mechanically Enhanced, Antioxidant, and Biodegradable SPI/OAG Films via Synergistic Schiff Base Chemistry and Hydrogen Bonding Interactions

Zhulan Liu, Ren’ai Li, Hongzhuang Zhang, Mengqing Li, Yunfeng Cao
article en
6 citations

Abstract

Excessive use of nondegradable plastics has raised environmental concerns, promoting the development of high-performance and eco-friendly materials. Polysaccharides and proteins, which offer advantages such as affordability and biodegradability, have potential in packaging but are limited in barrier and mechanical properties. Herein, using 30% acetic acid as a solvent for soy protein isolate (SPI) and introducing oxidized arabinogalactan (OAG) into the system, highly transparent (90%) and ultraviolet-shielding SPI/OAG flexible films were successfully prepared via Schiff base chemical cross-linking and hydrogen bond interactions between the components. The synergistic cross-linking of SPI and OAG effectively increased mechanical strength (tensile strength of 6.93 MPa), improved oxygen and water vapor barrier properties, and reduced swelling in the SPI/OAG films. The films exhibited good antioxidant activity (81.75% for ABTS and 85.34% for DPPH), effectively retarded browning and weight loss of strawberry and apple pieces, and were biodegradable in soil. The prepared SPI/OAG films had advantages over existing SPI-based films, including a uniform structure, low oxygen permeability, and excellent sustainability. This research demonstrates that SPI/OAG cross-linked films have strong potential in biodegradable packaging and as a substitute for petroleum-based plastics.

ACS Applied Materials & InterfacesVol. 16(48)
Nanjing Forestry University (CN)
Natural Science Foundation of Jiangsu Province, Key Laboratory of Optoelectronic Chemical Materials and Devices
Openalex Percentile: Top 26%
Electrospun Nanofibers in Biomedical Applications
1.04
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