Recent Advances in Signal Integrity Simulation and Analysis of Interposers

This paper presents recent advances for analyzing signal integrity in interposer-based interconnect systems. It proposes a BEM solver methodology that reduces the computational resources by over 40 times compared to FEM.

Authors

Feng Ling (ORCID: https://orcid.org/0000-0002-0685-4897)
Jonatan Aronsson (ORCID: https://orcid.org/0000-0002-4254-2743)

Institutions

Bellevue Hospital Center (US)

Publication Details

Published: 2024-10-06
DOI: https://doi.org/10.1109/epeps61853.2024.10754007
Citations: 1
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.21

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article

Recent Advances in Signal Integrity Simulation and Analysis of Interposers

Feng Ling, Jonatan Aronsson

Oct 6, 2024

1 citations

3D IC and TSV technologies

0.21

article

Recent Advances in Signal Integrity Simulation and Analysis of Interposers

Feng Ling, Jonatan Aronsson

October 6, 2024article en

1 citations

Abstract

Bellevue Hospital Center (US)

Climate action

Openalex Percentile: Top 46%

3D IC and TSV technologies

0.21

DOI Source OpenAlex

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Recent Advances in Signal Integrity Simulation and Analysis of Interposers — Feng Ling, Jonatan Aronsson · (2024) | TGRS Research Map | TGRS