Accelerating Die Bond Quality Detection Using Lightweight Architecture DSGβSI-Yolov7-Tiny

The die bonding process is one of the most critical steps in the front-end semiconductor packaging process, as it significantly affects the yield of the entire IC packaging process. This research aims to find an efficient, intelligent vision detection model to identify whether each chip correctly adheres to the IC substrate; by utilizing the detection model to classify the type of defects occurring in the die bond images, the engineers can analyze the leading causes, enabling timely adjustments to key machine parameters in real-time, improving the yield of the die bond process, and significantly reducing manufacturing cost losses. This study proposes the lightweight Yolov7-tiny model using Depthwise-Separable and Ghost Convolutions and Sigmoid Linear Unit with β parameter (DSGβSI-Yolov7-tiny), which we can apply for real-time and efficient detection and prediction of die bond quality. The model achieves a maximum FPS of 192.3, a precision of 99.1%, and an F1-score of 0.97. Therefore, the performance of the proposed DSGβSI-Yolov7-tiny model outperforms other methods.