Introduction of thick AlN coating on Si for 3D-IC thermal management

Abstract In addressing the thermal management issues of three-dimensional stacking of integrated chips (3D-ICs), we propose to introduce an aluminum nitride coating by an aerosol deposition method as a chiplet encapsulation material. The deposition rate of the thick AlN film on a Si substrate reaches as high as 1.1 m/min without damaging the substrate by adjusting the material powder size. Additionally, we demonstrate excellent fillability in trenches corresponding to the size between chiplets, which ensures its applicability for a novel molding process of 3D-ICs.