An Efficient SPICE-compatible Model for Fast Co-simulation of Signal and Power Integrity on Multilayer PCB with Arbitrary Shape
This paper presents the SPICE-compatible model to efficiently simulate and analyze the multilayer PCBs with arbitrarily shaped plates, signal/power/ground vias, and multi-coupled traces. This model is compared and evaluated using full-wave simulation. The results demonstrate that the proposed model significantly reduces computational time while maintaining high accuracy for complex PCB designs, achieving high efficiency.
Authors
- Seunghun Ryu (ORCID: https://orcid.org/0000-0002-7967-9436)
- Seonghi Lee (ORCID: https://orcid.org/0000-0003-4829-2551)
- Seungyoung Ahn (ORCID: https://orcid.org/0000-0002-0771-7050)
- Sanguk Lee (ORCID: https://orcid.org/0000-0002-9612-7801)
- Dongryul Park (ORCID: https://orcid.org/0000-0001-9846-7634)
- Hyun‐Woo Kim (ORCID: https://orcid.org/0000-0003-3764-1648)
- Dong-Kyun Kim
- Jinwook Lee (ORCID: https://orcid.org/0000-0002-4426-8880)
Institutions
- Korea Advanced Institute of Science and Technology (KR)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10754366
- Citations
- 1
- Primary Topic
- Electromagnetic Compatibility and Noise Suppression
- Type
- article
- Field-Weighted Citation Impact
- 0.21