Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration
This paper presents an efficient and accurate method to perform multiphysics-informed floorplan and placement of heterogeneously integrated chiplets. Traditional multiphysics simulations, often impractical in optimization due to high computational cost, are replaced by a high-fidelity and efficient generative model via image-based machine learning (ML). Utilizing the ML model for fast performance assessment, we further accelerate the physical design by developing a dynamic rank-revealing algorithm for solving the underlying large-scale constrained optimization problem. Application to chiplet floorplanning and comparison with prevailing methods have demonstrated the superior performance of the proposed work.
Authors
- Seunghyun Hwang (ORCID: https://orcid.org/0000-0002-5900-6445)
- Dan Jiao (ORCID: https://orcid.org/0000-0002-4080-2716)
- Vinicius C. do Nascimento (ORCID: https://orcid.org/0000-0001-6387-9161)
- Ganesh Subbarayan (ORCID: https://orcid.org/0000-0003-0462-1130)
- Qiang Qiu (ORCID: https://orcid.org/0000-0003-2610-3502)
- Michael J. Smith (ORCID: https://orcid.org/0009-0008-1268-2332)
- Cheng‐Kok Koh
Institutions
- Purdue University West Lafayette (US)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10753698
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00