Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration

This paper presents an efficient and accurate method to perform multiphysics-informed floorplan and placement of heterogeneously integrated chiplets. Traditional multiphysics simulations, often impractical in optimization due to high computational cost, are replaced by a high-fidelity and efficient generative model via image-based machine learning (ML). Utilizing the ML model for fast performance assessment, we further accelerate the physical design by developing a dynamic rank-revealing algorithm for solving the underlying large-scale constrained optimization problem. Application to chiplet floorplanning and comparison with prevailing methods have demonstrated the superior performance of the proposed work.

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Publication Details

Published
2024-10-06
DOI
https://doi.org/10.1109/epeps61853.2024.10753698
Primary Topic
3D IC and TSV technologies
Type
article
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article

Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration

Seunghyun Hwang, Dan Jiao, Vinicius C. do Nascimento, Ganesh Subbarayan et al.
3D IC and TSV technologies
article

Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration

Seunghyun Hwang, Dan Jiao, Vinicius C. do Nascimento, Ganesh Subbarayan, Qiang Qiu, Michael J. Smith, Cheng‐Kok Koh
article en

Abstract

This paper presents an efficient and accurate method to perform multiphysics-informed floorplan and placement of heterogeneously integrated chiplets. Traditional multiphysics simulations, often impractical in optimization due to high computational cost, are replaced by a high-fidelity and efficient generative model via image-based machine learning (ML). Utilizing the ML model for fast performance assessment, we further accelerate the physical design by developing a dynamic rank-revealing algorithm for solving the underlying large-scale constrained optimization problem. Application to chiplet floorplanning and comparison with prevailing methods have demonstrated the superior performance of the proposed work.

Purdue University West Lafayette (US)
Openalex Percentile: Top 81%
3D IC and TSV technologies
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Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration — Seunghyun Hwang, Dan Jiao, et al. · (2024) | TGRS Research Map | TGRS