Multiphysics Simulation and Measurement Correlation of a Multichip Module IC Package Current Sensor

As the semiconductor market shifts its focus to 3D integration, lowest cost, and high performance, the need for advanced analog packaging technologies becomes paramount. Integrating multichip and passives onto cost-effective package technologies create opportunities for highly competitive semiconductor products. However, this aggressive integration also leads to complex multiphysics and multiscale interactions, especially for small-form-factor modules. This work describes the multiphysics (electrical-thermal-mechanical) co-design modeling methodology that resulted in the industry's first highly accurate, voltage-output multichip module current-sense integrated circuit. The reliability of the multiphysics modeling methodology was confirmed by directly comparing it to measurements taken on a 36V, bi-directional, precision current sense amplifier with an integrated shunt resistor evaluation module (EVM). The study demonstrates a strong correlation (within +/- 0.3-2.5% difference) between simulation and laboratory measurements, underscoring the practical relevance and impact of our research.