Simulation Method for Quasi-Static Solver to Effectively Model Parasitic Components Between Package and PCB
A methodology to simulate Package and PCB with a quasi-static solver is developed. The widespread cascade method, where Package and PCB are first simulated standalone to reduce the required computational effort and then recombined, is improved to consider electromagnetic interactions between the two systems. The proposed approach provides results very similar to that achieved with the full system simulation, but with a computational cost that is very similar to that of the standard cascade method.
Authors
- Fabio Pareschi (ORCID: https://orcid.org/0000-0001-8777-7135)
- Davide Lena (ORCID: https://orcid.org/0000-0003-4184-6152)
- Silvia De Simone (ORCID: https://orcid.org/0000-0002-3647-7869)
- Gianluca Setti (ORCID: https://orcid.org/0000-0002-2496-1856)
Institutions
- Politecnico di Torino (IT)
- STMicroelectronics (Italy) (IT)
- King Abdullah University of Science and Technology (SA)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10754476
- Primary Topic
- Material Properties and Processing
- Type
- article
- Field-Weighted Citation Impact
- 0.00