Fan-Out Region Crosstalk Optimization of High-Density PCIe 6.0 SMT Connectors
This study compares various fan-out design approaches for high-density SMT connectors in modular systems. Both simulations and measurements show significant crosstalk differences, which can be instrumental in layout optimization for PCIe 6.0 signal integrity design.
Authors
- Mengmeng Guo (ORCID: https://orcid.org/0000-0002-1897-7560)
- Wei Bing
- Dan Liu (ORCID: https://orcid.org/0009-0005-4228-4982)
- Jingbo Li (ORCID: https://orcid.org/0000-0002-6130-7538)
- Yangfan Zhong (ORCID: https://orcid.org/0000-0002-2305-711X)
- Weizhe Li (ORCID: https://orcid.org/0000-0003-2779-1458)
- Tina Bao (ORCID: https://orcid.org/0009-0006-6136-7916)
- Minzheng Tian
Institutions
- Intel (United States) (US)
- China Datang Corporation (China) (CN)
- Alibaba Group (China) (CN)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10754021
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00