Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging
Advances in high-performance computing are driving thermal analysis for 3D chip-stacking packaging to assess its heat dissipation. Rather than the finite-element method, an efficient and accurate semi-analytic estimation method of temperature distribution is proposed.
Authors
- Ruey‐Beei Wu (ORCID: https://orcid.org/0000-0001-5735-2152)
- Chien-Min Lin (ORCID: https://orcid.org/0009-0003-0913-1090)
- Cheng-Yuan Lu
Institutions
- National Taiwan University (TW)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10753706
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21